The Hot Take: Everyone wants a piece of that Ai pie. Even toilet makers....
It's pledged to invest more into its division making ceramics used in the production of NAND memory.
Read the full articleThe Hot Take: Getting confusing with weather they are dropping their GPU's.
Benchmarks of Intel's upcoming and fastest gaming handheld SoC, the Arc G3 Extreme, have been leaked, surpassing the Ryzen Z2 by 25%. Intel Packs Its Strongest Battlemage GPU, & 14 CPU Cores Inside the Arc G3 Extreme Gaming Handheld SoC We recently covered Intel's first Arc G3 gaming handheld, which has been listed by online retailers. While the retailer listing was void of details for the SoC itself, we now have more specs and even benchmarks of the upcoming chip & they look phenomenal. Starting with the CPU, the Intel Arc G3 Extreme is going to be the top offering [ā¦]Read full article at https://wccftech.com/intels-arc-g3-extreme-handheld-chip-crushes-ryzen-z2-extreme-benchmark-leak/
Read the full articleThe Hot Take: Better with less change seems to be a win!
Intel is preparing to present a refined version of its 18A process technology at the VLSI 2026 Symposium, introducing the 18A-P node as an optimized variant focused on improving power and performance characteristics without altering transistor density.
Read the full articleThe Hot Take: If this can even compete with HBM4 then intel has a HUGE win.
Intel and SoftBank, through their joint venture Saimemory, are working on a new memory architecture aimed at addressing bandwidth limitations in AI accelerators.
Read the full articleThe Hot Take: Intel winning all this business just means the domestic creation of products has accelerated to me. Only way they're going to get US Government Contracts or be able to sell in the US Borders. Prime example the router ban they just enacted.
Intel continues to see increased confidence for its upcoming Foundry technologies, such as 18A-P, 14A, and EMIB. Apple & Google Will Reportedly Leverage Intel Foundry 18A-P & EMIB Technologies, 14A Customers Also Lining Up. The Agentic AI and Inferencing boom has led to a significant surge in CPU demand. This has led major semiconductor companies such as TSMC to face severe supply constraints, all the while going on a large-scale expansion spree to meet demand. At the same time, Intel has been driving revenue up by selling off salvaged dies, but the company is also attracting the attention of various [ā¦]Read full article at https://wccftech.com/intel-18a-p-pulls-in-apple-next-m-chips-emib-reportedly-wins-google-tpuv8e/
Read the full articleThe Hot Take: Charge top dollar your union workers are going to want a slice of that pie. Just like any Government.
Samsung Electronics is preparing for a significant labor disruption as its primary union has announced an 18-day general strike scheduled from May 21 to June 7, 2026.
Read the full articleThe Hot Take: Apple to me is starting to look better and better I hate to say it.
It wouldn't be Google if it did not somehow try to hobble its Tensor-class chips. And, this unfortunate trend appears all set to continue with the upcoming Tensor G6 SoC, which is quite likely to sport a GPU that launched all the way back in 2021! A new leak indicates that the Google Tensor G6 chip will sport the PowerVR CXT-48-1536 GPU that debuted in 2021 As our readers would be well aware, we had ripped into Google a few months back for using generations-old ARM CPU cores within the Tensor G5 chip. Thankfully, as per recent leaks, Google has [ā¦]Read full article at https://wccftech.com/google-tensor-g6-chip-likely-to-launch-with-an-ancient-gpu-that-debuted-around-5-years-back/
Read the full articleThe Hot Take: Will be interesting to see where this goes. I'm wondering what type of cooling/heating this will bring using this medium over what it's replacing.
Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased [ā¦]Read full article at https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/
Read the full articleThe Hot Take: Interesting, is this feedback because people STILL want high performance parts? To me it looks like they've all been trying to push us to mid-range devices that we're not supposed to own either.
NVIDIAās plans to enter the APU market are becoming clearer, as new leaks outline the specifications and timeline for its upcoming N1X SoC. The chip represents a shift for NVIDIA, combining an Arm-based CPU with a Blackwell GPU in a single package aimed at high-performance laptops and compact desktop systems.
Read the full articleThe Hot Take: We need the market to get a flood of these CUDIMMs as it seems they're capping classic DDR5 to 6400mt/s from the looks of it. New intel chips support this standard and it seems the only way to break that 6400mt/s barrier now.
Memory profiles rarely sound excitingāuntil a system starts acting up, fails to boot, or turns into a test of patience with manually adjusted timings. AMDās EXPO 1.2 isnāt exactly the kind of thing youād see on a big stage with a smoke machine, but itās a thoroughly important update for AM5. Itās about DDR5 compatibility, [ā¦] Source
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