The Hot Take: Ai usage growing pretty steady and fast it would appear.
Anthropic is partnering with SpaceX to ease capacity constraints that have stranded Claude customers, a gesture that may soothe developer discontent about service availability and cost. Ami Vora, chief product officer at Anthropic, announced the expanded rate limits during Code for Claude, a developer event livestreamed from San Francisco. "As of today, we are increasing rate limits for developers on Claude Code and the Claude Platform," said Vora. "More specifically, we are doubling Claude Code's five-hour rate limits for Pro, Max, Team, and…
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By ckasprzak | TkOut | May 8, 2026 |
Hardware
The Hot Take: Ai & GPUs need that bandwidth.
Rambus wants to address ongoing AI bandwidth problems with its new PCIe 7.0 Switch IP that features Time Division Multiplexing. Rambus Introduces PCIe 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure Press Release: Rambus, a premier chip and silicon IP provider making data faster and safer, today announced the Rambus PCIe 7.0 Switch IP with Time Division Multiplexing (TDM), a new addition to its advanced interconnect IP portfolio designed to address the rapidly escalating bandwidth, latency, and…
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The Hot Take: So was ARM not breaking into the WinTel market so they shifted to Ai market or are they just chasing the highest dollars?
Investment bank UBS reckons agentic AI will send CPU demand soaring, with Arm and AMD best placed to grab the spoils.
UBS analysts believe the growth of agentic AI software will drive strong demand for CPUs in the AI era. The bank said agentic AI increases processor workloads and favours chips with higher core counts and better power efficiency.
That view gives Arm the biggest potential upside, followed by AMD. Intel could benefit too, since a growing total addressable market tends to lift more than one silicon boat.
In fresh coverage of…
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The Hot Take: If this all is true they have a winner on their hands.
Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more…
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The Hot Take: RISC-V breaking the GPU strangle hold on GPU's? YES PLEASE.
Tenstorrent made a bold claim during their TT-Deploy livestream, saying they are going to crush everyone at everything, including AI, with their Galaxy servers. Tenstorrent Galaxy Supercluster Offers 10x Faster GenAI Video, And Destroys Current-Gen GPUs With "Blitz Mode", Offering 350+ Tokens/s In DeepSeek R1 Jim Keller and his Tenstorrent are on a mission to challenge the existing AI hierarchy with their RISC-V-powered platforms. As such, the company unveiled its latest Galaxy Blackhole servers for AI at scale. With Galaxy Blackhole,…
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The Hot Take: Just what we need Ai specific instructions for them to gobble up all the CPU's now.
APX or Advanced Performance Extensions are the next evolution of x86 as Intel & AMD co-develop new standards for the architecture. APX Expands the x86 Instruction Set, Bringing Faster Performance & New Features That Will Benefit Both Intel and AMD's Next-Gen Chips Two days ago, we talked about ACE (AI Compute Extensions), which is a unified instruction set that aims to increase matrix-multiply performance for next-gen x86 chips. ACE is just one part of the grander scheme in which both Intel and AMD are working together to evolve the…
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The Hot Take: HBM competitor would be good bringing Ai accelerator competition for RAM. Intel bringing it should help Intel to catch up in the Ai game for sure.
Japan’s SaiMemory, a SoftBank subsidiary collaborating with Intel, has secured NEDO funding to develop Z-Angle Memory (ZAM), a next-gen DRAM architecture addressing HBM limitations
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The Hot Take: We all desperately need this to not be vapor-ware!
A relatively unknown U. S. -based startup, Bolt Graphics, has announced that it has successfully taped out the first test chip of its Zeus GPU architecture. The company positions Zeus as a disruptive compute accelerator, previously claiming performance up to 150% higher than an NVIDIA GeForce RTX 5090 while consumi ...
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The Hot Take: Intel needs this licensing support as other law suits are back in court with patent trolls....
Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab.
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The Hot Take: Getting cozier with your previous manufacturing division in a previous life.
AMD will be leveraging GlobalFoundries for the development of its MRM Co-packaged Optic solution for the next-gen Instinct MI500 AI accelerators. GlobalFoundries & AMD Working Together on Co-Packaged Optics Hardware For Instinct MI500 Accelerators CPO or Co-Packaged Optics (Silicon Photonics) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals. These CPOs are packaged alongside hardware accelerators such as GPUs and will be a key solution for next-gen AI factories, offering improved…
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