The Hot Take: ASML's monopoly needs get challenged, but not sure if Quantum will just make them invalid. We'll have to wait and see I guess.
Intel has entered high-volume manufacturing using ASML's High NA extreme ultraviolet (EUV) lithography technology for a subset of its Intel Core Ultra Series 3 "Panther Lake" processors, becoming the first company to ship high-volume logic products manufactured with the technology. ASML announced the milestone in an official press release on Wednesday, July 15, confirming that Intel Foundry is running the qualified High NA layers on its Intel 18A process node in Oregon.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade reshapes chipmakingAccording to ASML, Intel is using High NA EUV to pattern selected Intel 18A layers, with products already shipping to customers at yields matched to those achieved on ASML's existing NXE EUV platform. These layers are dual-qualified, meaning the same layer can be exposed on either an existing 0.33 NA NXE scanner or a 0.55 NA EXE scanner, with the resulting wafers being interchangeable.High NA EUV has long been viewed as the successor to today's EUV lithography, promising to extend semiconductor scaling by enabling manufacturers to print smaller, denser circuit patterns that are becoming difficult to achieve with existing tools. Until now, the platform had been confined to R&D work. ASML’s announcement marks the first time High NA EUV has been used to produce and ship a high-volume commercial logic product. Panther Lake, built on the Intel 18A manufacturing process, is spearheading this transition. Rather than replacing the company's entire lithography flow, Intel is applying High NA EUV to specific layers while the remainder of the chip continues to be manufactured using conventional lithography. High NA EUV builds on the same 13.5-nanometer extreme ultraviolet light used by today's scanners but increases the optical system's numerical aperture (NA) — how much light a lens system can collect and focus onto a silicon wafer — from 0.33 to 0.55. The higher value resolves finer features in a single exposure, allowing chipmakers to print smaller patterns with greater precision and process control.This increased resolution is expected to reduce reliance on complex multi-patterning techniques for some of the industry's most demanding layers, thereby simplifying manufacturing and improving feature fidelity. In the long term, these capabilities are expected to support higher transistor densities and improved performance in future processors, particularly as AI workloads continue driving demand for increasingly advanced semiconductor technologies."With increased resolution and better process control, the introduction of High NA EUV marks a substantial development in semiconductor lithography," said ASML President and CEO Christophe Fouquet. "We are proud to play a role in enabling the smaller, denser patterning that will accelerate advancements in AI and other emerging technologies." Intel and ASML have been working towards this milestone for several years. In 2024, Intel completed installation of one of the industry's first commercial High NA EUV lithography systems, the TWINSCAN EXE:5000, at its Hillsboro, Oregon, research and development facility. The company later became the first to qualify ASML's second-generation TWINSCAN EXE:5200B, which increases wafer throughput and overlay accuracy while incorporating an improved EUV light source over its predecessor.While the announcement represents High NA EUV's commercial debut, it does not mean Panther Lake is manufactured entirely using the new lithography platform. Instead, Intel has qualified High NA for selected layers, an approach that mirrors how new lithography generations are typically introduced into advanced semiconductor production before broader adoption across future nodes.Intel Foundry Executive Vice President and General Manager Naga Chandrasekaran said that qualifying the High NA process option on selected Intel 18A product layers enables the company's existing tool fleet to deliver higher manufacturing output while providing flexibility for future process technologies.Panther Lake itself is not a future product. Intel launched Core Ultra Series 3 at CES on January 5, 2026, opened preorders the following day, and put systems on shelves globally from January 27. The Core Ultra X9 378H followed in April alongside the value-tier Core Series 3, code-named Wildcat Lake, and the handheld-focused Arc G3 parts arrived on May 28.The announcement’s statement that the product is shipping to customers refers to wafer flow from the fab into the supply chain, rather than to a product launch. ASML says the two companies will continue working on High NA readiness, with the flexibility to incorporate the technology into future nodes based on customer needs — most immediately, Intel 14A, which Intel has designed to use High NA on a set of its tightest-pitch layers.
The Hot Take: Was almost like they were purposefully crippling their processors under past management.
Intel Nova Lake CPUs will mark the return of AVX-512, a feature that has long been abandoned by the company for its client CPUs. AVX-512 Is Coming Back To Intel's Consumer CPUs, Starting With Nova Lake Intel has had a love-hate relationship with AVX-512 on its consumer CPUs. The AVX-512 instruction set was last seen on Intel's Tiger Lake (11th Gen) family, and since then, the company has offered no support for it on its modern-day chips. Meanwhile, AMD has been offering AVX-512 support on its Zen 4 and Zen 5 chips, both client and server platforms. Last year, we […]Read full article at https://wccftech.com/intel-nova-lake-cpus-to-bring-back-avx-512-support-six-years-after-it-was-abandoned/
The Hot Take: Oh so the Ultra series aren't just crap then? /smh
It's curious to call this one a leak, exactly, since the original source is direct from AMD and live on the web, but here we go: AMD's Vishal Badole submitted a patch for the Linux Kernel that he describes as adding support for "a Low Power core type, in addition to the existing Performance and Efficiency types." That's pretty clear-cut.
Now,
The Hot Take: I just hear Tim Allen in my head from tool time.
Intel is expected to push the boundaries on power draw with its upcoming Nova Lake series processors, which will rival the best CPUs. According to newly leaked information, the flagship 52-core desktop variant is expected to feature a dual-compute tile architecture with a massive PL2 limit of 474W. The information was shared by LC Tech Leaks and confirmed by Jaykihn, who has a pretty solid track record with Intel hardware.PL2, or Power Limit 2, represents the maximum power a CPU can draw during short boost periods. That said, a PL2 target of 474W remains quite demanding, although a previous rumor suggests Intel may also have a PL4 emergency power limit over 700W. It is important to note that these power limits may only apply to the top-end models with the dual-tile architecture.Additionally, the leak also sheds light on the upcoming platform, including the previously rumored LGA1954 socket. We already know that Nova Lake-S will require a new generation of motherboards. Motherboard vendors are expected to classify their boards by sustained PL1 power levels, with configurations for 35W, 65W, 125W, and 175W CPUs. Enthusiast-grade motherboards, likely the Z990 series, are also rumored to feature three EPS 8-pin CPU power connectors instead of the traditional two. While vendors will have the option to include a third connector, its primary purpose would be to support extreme overclocking and would not affect the CPU's rated performance profile.The upcoming Nova Lake-S lineup is expected to carry the ‘Core Ultra 400S’ moniker and will be Intel's biggest desktop CPU overhaul in years. We’ve previously reported leaked specifications indicating configurations ranging from 6 to 52 cores, with support for DDR5-8000 memory. The flagship 52-core model is expected to feature 16 performance cores, 32 efficiency cores, and a new Big Last Level Cache (bLLC) design to take on AMD's 3D V-Cache gaming dominance. The company is also rumored to introduce integrated Xe3 graphics, Thunderbolt 5, PCIe 5.0 connectivity, and an upgraded NPU for AI workloads.While these specifications are unconfirmed, it is clear that Intel is targeting substantial gains in gaming, multi-threaded performance, and overall platform capabilities with its next-gen processors.
The Hot Take: Why did it disappear in the first place?
AMD has confirmed that it will restore Transparent Secure Memory Encryption (TSME) support on consumer Ryzen processors after previously removing the feature through AGESA firmware updates.
The Hot Take: It seems Nvidia is hedging two architectures against each other. x86 vs ARM. They've been working with MediaTek to create the Spark SoC.
According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been added to its internal product roadmap and is expected to launch in the first quarter of 2028, potentially making its public debut at CES 2028.
The Hot Take: AMD getting ready for Intel refocus on HPDT?
With Threadripper, it has always been a bit like heavy-haul transport on the motorway: massively overdimensioned for normal users, but for certain workloads exactly the kind of tool where every additional lane matters. Now AMD’s next workstation generation has become tangible for the first time. An entry for “TR6 Mustang Peak” has appeared in AMD’s […]
By ckasprzak | TkOut | June 17, 2026 | ARM, Hardware
The Hot Take: I question this very much.
Servers employing x86 chips from AMD and Intel now account for little more than half of server revenue, according to the latest figures from IDC. In its Worldwide Quarterly Server Tracker for Q1 2026, the analyst firm says that non-x86 server revenue hit $58.7 billion, representing a startling increase of 107 percent over the same period last year. The results mean that those non-x86 servers make up 47.9 percent of the market revenue, closing in rapidly on the amount of cash spent on x86 boxes. The growth in non-x86 turnover is likely thanks to systems powered by Nvidia’s AI chips featuring Arm cores. Although there is high demand for these, they also cost a pretty packet compared to an average datacenter box. In fact, IDC noted a stark divide shaping the worldwide server market, which reached $122.6 billion in vendor revenue during this period, a 30.4 percent increase year-on-year. On the one hand, AI infrastructure investment from hyperscalers and large cloud providers is “running at a scale that shows no sign of plateauing,” while everything else - the non-accelerated segment - faces a supply-constrained environment, thanks largely to that AI infrastructure spending. As Reg readers will know, memory chipmakers are prioritizing manufacturing capacity for higher margin products for AI servers and GPUs, starving the rest of the market of supply. Component availability, particularly DRAM and NAND flash, is limiting near-term shipment volumes from vendors, IDC says, though order pipelines are strong. Supply of the right chips is therefore the chief limiting factor on server market growth. Revenue for x86 servers still reached $63.9 billion, but this was a decline of 2.9 percent due to those component supply constraints impacting shipment volumes. GPU accelerated servers pulled in $68.9 billion for the vendors, up nearly 25 percent year-on-year, while other accelerated servers surged a massive 122 percent to $17.7 billion. The latter category represents AI systems configured with FPGAs or ASICs rather than GPUs. IDC’s spin on the data is that AI infrastructure adoption is no longer limited to hyperscalers, thanks to developments such as government-led sovereign AI initiatives, while the non-accelerated segment tells a more nuanced story. Although revenue here declined, underlying demand remains strong, but many enterprise customers are holding out against elevated component prices. “Companies aren’t pulling back from infrastructure investment; they’re just not getting servers as fast as they need them. Longer term, emerging workloads, including agentic applications and physical AI ecosystems, will keep demand elevated well beyond the current cycle,” commented IDC research director Juan Seminara. The firm says it expects to see supply normalization beginning in 2027, with capacity relief coming as chipmakers bring new fabrication plants online. Across the last two decades, non-x86 servers accounted for less than ten percent of revenue, and most of that went to IBM which emerged as the last vendor of proprietary servers as Oracle lost interest in Sun and the likes of HPE decided they couldn't sustain businesses built on exotic architectures. ®
The Hot Take: This is an interesting collaboration between the two seeing intel keeps saying they're not going to stop GPU development.
Intel's Serpent Lake SoCs featuring NVIDIA's RTX GPU tiles as integrated graphics are expected to roll out by Q1 2028. Intel & NVIDIA's Co-Developed Serpent Lake SoCs Featuring Next-Gen CPU & GPU Architectures Rumored For Q1 2028 Last year, Intel announced that it was working with NVIDIA on a custom SoC that would incorporate NVIDIA's RTX GPU tiles. Intel stated that these SoCs will power a wide range of PCs that require the integration of these levels of CPUs & GPUs together into a single package. It looks like we have our first timeline of when these SoCs will be […]Read full article at https://wccftech.com/intel-serpent-lake-socs-with-nvidia-rtx-gpu-tiles-reportedly-arrive-in-q1-2028/
The Hot Take: Question is, do I go HPDT with Z990 or Consumer Z970? I guess I'll have to see the benches on if HPDT does anything for Gaming.
The Z990 PCH for Nova Lake motherboards is apparently 22% smaller than Z890, despite featuring a higher power maximum power draw of up to 14W. The leaked picture of the PCH shows a 11.15 x 6.5mm die and 25 x 24mm package, but we're unsure what motherboard it actually comes from.