42 posts
The Hot Take: Better with less change seems to be a win!
Intel is preparing to present a refined version of its 18A process technology at the VLSI 2026 Symposium, introducing the 18A-P node as an optimized variant focused on improving power and performance characteristics without altering transistor density.
Read the full articleThe Hot Take: Intel winning all this business just means the domestic creation of products has accelerated to me. Only way they're going to get US Government Contracts or be able to sell in the US Borders. Prime example the router ban they just enacted.
Intel continues to see increased confidence for its upcoming Foundry technologies, such as 18A-P, 14A, and EMIB. Apple & Google Will Reportedly Leverage Intel Foundry 18A-P & EMIB Technologies, 14A Customers Also Lining Up. The Agentic AI and Inferencing boom has led to a significant surge in CPU demand. This has led major semiconductor companies such as TSMC to face severe supply constraints, all the while going on a large-scale expansion spree to meet demand. At the same time, Intel has been driving revenue up by selling off salvaged dies, but the company is also attracting the attention of various […]Read full article at https://wccftech.com/intel-18a-p-pulls-in-apple-next-m-chips-emib-reportedly-wins-google-tpuv8e/
Read the full articleThe Hot Take: Will be interesting to see where this goes. I'm wondering what type of cooling/heating this will bring using this medium over what it's replacing.
Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]Read full article at https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/
Read the full articleThe Hot Take: I'm wondering if they're holding out to see if China catches up to ASML's equipment as I know they are dumping boat loads of money to try and catch up to ASML's monopoly.
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.
Read the full articleThe Hot Take: Intel needs this licensing support as other law suits are back in court with patent trolls....
Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab.
Read the full articleThe Hot Take: Good news for both of them! TSMC needs to be brought into check on 2nm to bring prices down for all of us.
Qualcomm CEO Cristiano Amon has been spotted in Korea meeting with Samsung executives. The trip is all about manufacturing chips on the 2nm process, and there's a chance that Qualcomm will turn to Samsung to fabricate the upcoming Snapdragon 8 Elite Gen 6 SoCs. Back at CES in January, Amon revealed that Qualcomm was talking to Samsung about this, and it seems like the discussions are still ongoing. If all this pans out and Qualcomm does indeed pick Samsung to fab the next top of the line Snapdragon SoC, it would mark a return to the Korean company for the first time since 2022, which is...
Read the full articleThe Hot Take: Getting cozier with your previous manufacturing division in a previous life.
AMD will be leveraging GlobalFoundries for the development of its MRM Co-packaged Optic solution for the next-gen Instinct MI500 AI accelerators. GlobalFoundries & AMD Working Together on Co-Packaged Optics Hardware For Instinct MI500 Accelerators CPO or Co-Packaged Optics (Silicon Photonics) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals. These CPOs are packaged alongside hardware accelerators such as GPUs and will be a key solution for next-gen AI factories, offering improved interconnect latency and creating high-bandwidth connections between CPU and GPU. Both AMD and NVIDIA will be leveraging these technologies for their next-gen AI […]Read full article at https://wccftech.com/amd-taps-globalfoundries-for-mi500-co-packaged-optics/
Read the full articleThe Hot Take: US Domestic manufacturing is going to be getting slammed here soon.
Elon Musk lays out the plans for Tesla's future AI ecosystem, utilizing both Samsung & TSMC 2nm tech for AI6 & AI6.5 chips. Tesla's 2nm Duo Confirmed: AI6 Goes Samsung With LPDDR6 & AI6.5 Goes TSMC With Improved Performance A few days ago, Tesla announced the successful tape out of its AI5 chip, made at Samsung. The chip is just one of the many custom silicon designs that Elon Musk and his enterprises are making to fulfill their in-house AI demand. Musk also talked about the next-generation chips, such as AI6 and the Dojo3 supercomputer project. The company is aiming […]Read full article at https://wccftech.com/tesla-pulls-2nm-ai-chip-production-onto-us-soil-splits-ai6-ai6-5-between-samsung-tsmc/
Read the full articleThe Hot Take: More good news on them clawing back to relevance again in the manufacturing arena.
Intel's Foundry business will soon house some big names by the end of this year as its 14A technology gains huge momentum. Intel 14A Technology Will Be A Game Changer For Chipzilla As It Hopes To Get Some Big Names Onboard By The End of This Year Intel's Foundry success relies a lot of it's upcoming 14A process technology. The 14A node is designed to attract external customers more so than it is designed for internal use. That's something that 18A is built for. So far, Intel hasn't publicly named any big customers for its 14A technology, but it makes […]Read full article at https://wccftech.com/intel-to-land-big-14a-wins-with-surprise-customers-by-the-end-of-this-year/
Read the full articleThe Hot Take: Good sign that Intel is clawing back it's manufacturing prowess.
Stripped-down Ultra for laptops and low-power edge boxes Intel brought a few more chips home from Taiwan this week, with a new round of budget-oriented Core Series 3 processors fabbed right in the US-of-A.…
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